Ti/Pt Schottky contact measurements for HEMT gate metallization using current-voltage method
Ashaari Yusof1, Soetedjo, Hariyadi2, Mohd Nizam Osman3, Asban Dolah4, Mohamed Razman Yahya5, Abdul Fatah Awang Mat6, Azlan Abdul Aziz7, Kamarulazizi Ibrahim8.
A study of Schottky contact from Ti/Pt metal stack on Si-doped AlGaAs HEMT supply layer using current-voltage method is presented here. The Schottky barrier heights at metal-semiconductor junction were determined on two samples prepared by MBE. From plots of natural logarithm of current density versus voltage sweep, the values of current density at zero voltage were extrapolated, hence enabling the calculation of schottky barrier values. The effect of thermal annealing on Schottky barrier height for each samples were also discussed here. From this experiment, Schottky barrier heights with values for 0.65 eV has been successfully obtained from the metal-semiconductor interface.
Affiliation:
- TM Research & Development Sdn. Bhd., Malaysia
- TM Research & Development Sdn. Bhd., Malaysia
- TM Research & Development Sdn. Bhd., Malaysia
- TM Research & Development Sdn. Bhd., Malaysia
- TM Research & Development Sdn. Bhd., Malaysia
- TM Research & Development Sdn. Bhd., Malaysia
- Universiti Sains Malaysia, Malaysia
- Universiti Sains Malaysia, Malaysia
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