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A simulation on the effect of ultrasonic vibration on ultrasonic assisted soldering of Cu/SAC305/Cu joint
Hussein kadhim Sharaf1, Nawal Aswan Abdul Jalil2, Sadeq Salman3.
In the modern electronic packaging industry, the trend of miniaturization and the
demand for advanced features of electronic devices have greatly reduced the size
and weight of the electronic packages but increased the density of the packaging
system. Higher input/output current density has to flow through these miniature
interconnects or solder joints within the packaging system and thus, causing heat
generated by the system to increase tremendously. This has driven the packaging
design to include a built-in thermal enhancement feature, such as a large area
bottom metal or heat sink to provide a direct thermal path out from the package
to ease heat dissipation. So the main objectives of this study are to valid
experimental work for solder joint failure due to the ultrasonic vibration and to
investigate better mechanical properties for solder joint by FE analysis. ANSYS
software has been used to analysis boundary conditions with the assistance of
design modular (DM) to produce the model then export the model to ANSYS. After
that input boundary conditions, the output of the simulation is shear stress then
compare shear stress of experimental work with the output of the simulation.
From the finding of 87% comparison between simulation to experimental work so
will continue to try new parameters with same boundary conditions. It is showed
that the maximum shear strength is 55 MPa for Cu/SAC305/Cu when it treated
with 50 kHz for 4.5 sec and minimum shear strength is 35 MPa when it treated
with 70 kHz at control time (0 sec). finally, this study discovered that the best
method to improve mechanical properties for Cu/SAC305/Cu solder alloy treat
this solder joint with frequency 50 kHz for 4.5 sec to get maximum shear strength.
Affiliation:
- Universiti Putra Malaysia, Malaysia
- Universiti Putra Malaysia, Malaysia
- Universiti Putra Malaysia, Malaysia
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